Magnetron sputtering technology is widely used in the field of thin film preparation. The applications of decorative coating and tool coating are relatively common.
However, magnetron sputtering processing technology has many limitations. For example, when the sputtering current is large, which means the power density of a magnetron sputtering target is limited by the target heat load, bombardment of the target with excessive positive ions may cause the sputtering target to overheat and burn. Besides, it also has the disadvantages of limited sputtering energy and low metal ionization rate.
In recent years, a high-power pulsed magnetron sputtering (HiPIMS) technology has been developed at home and abroad, and this limitation has been greatly weakened. The peak power of high-power pulsed magnetron sputtering is about 100 times that of ordinary magnetron sputtering. The ionization rate of sputtered material is extremely high, and this highly ionized beam does not contain large particles. So, high quality film can be easily obtained by HiPIMS technology.
Since the pulse action time is within a few hundred microseconds, the average power of HiPIMS is comparable to that of ordinary magnetron sputtering, so that the requirement for magnetron target cooling is not increased. Although the instantaneous power of high-power pulsed magnetron sputtering is high, its average power is not high, so it can be widely used.