Vacuum evaporation, sputtering, ion plating

- Dec 23, 2020-

Vacuum evaporation, sputtering, ion plating

Vacuum evaporation method is a method of heating metals under high vacuum, making them melt and evaporate, and then forming a metal film on the surface of the sample after cooling. The coating thickness is 0.8-1.2um. The small concave and convex part on the surface of the forming product is filled to obtain the surface like a mirror. The underside coating must be carried out in order to achieve the effect of the mirror and vacuum evaporation, or to vacuum evaporation for the steel with low tightness.
Sputtering usually refers to the magnetic control sputtering, belongs to high - speed low - temperature sputtering method. Technological requirements of the vacuum degree in 1 x 10-3 torr, namely 1.3 x 10-3 pa vacuum inert gas argon (Ar), and the plastic base material (anode) and metal target material (cathode) and high voltage direct current (dc), because the glow discharge (glow discharge) produced by the electronic excitation of inert gas, plasma, plasma to metal atom bomb out of target material, is deposited on the plastic base material. General metal coating mostly uses DC splash plating, and non-conductive ceramic magnetic materials use RF ac splash plating.
Ion plating is a method of partially ionizing gas or vaporized material by gas discharge under vacuum condition, and depositing vaporized material or its reactants on the substrate under bombardment of gas ions or vaporized material ions. They include magnetron sputtering ion plating, reactive ion plating, hollow cathode discharge ion plating (hollow cathode evaporation method), multi-arc ion plating (cathode arc ion plating) and so on.

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