two types of sputtering coatings

- Aug 15, 2020-

 two types of sputtering coatings

One is called ion beam sputtering, which refers to bombarding the target surface with ion beam in the vacuum state, so that the sputtered particles can form a film on the surface of the matrix. This process is relatively expensive and is mainly used to make special films. The other is called cathode sputtering, which mainly USES the phenomenon of low-pressure gas discharge to make the ions in the plasma bombardment of the target surface and deposition of the sputtering particles on the matrix.It adopts the structure of parallel plate electrode, the large-area target made of membrane material is the cathode, the substrate supporting the matrix is the anode, and it is installed in the bell jar vacuum vessel. To reduce pollution, the pressure inside the bell jar is first pumped to less than L0-3 ~ 10-4pA, and then filled with Ar to maintain the pressure at L ~ 10Pa. Sputtering coating is performed by adding thousands of volts between the poles.
Compared with evaporation deposition, sputtering deposition has no phase change in the target material (film material), the compound composition is stable, and the alloy is not easy to fractionate, so the film material suitable for preparation is very wide.Since the energy of particles deposited on the substrate by sputtering is 50 times higher than that of evaporation, they have a cleaning and heating effect on the substrate, so the film has a strong adhesion. In particular, sputtering coating is easy to control the composition of the film. By direct sputtering or reactive sputtering, various alloy films, compound films, multilayer films and composite films with large area can be prepared uniformly. Sputtering coating is easy to realize continuous, automatic operation and scale production. However, due to the use of high voltage and gas during sputtering, the device is relatively complex, and the film is easily affected by the sputtering atmosphere, and the film deposition rate is also low. In addition, sputtering coating requires the preparation of various components of the target, the loading and unloading target is not convenient, the target utilization rate is not high.

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