The sputtering coating can be divided into:

- Mar 11, 2021-

The sputtering coating can be divided into:
DC dipole sputtering: only applicable to conductive films
DC tripole sputtering: only applicable to conductive films
DC quadrupole sputtering: only applicable to conductive film
Radio frequency sputtering: using radio frequency power supply, can be plated silicon oxide, alumina materials
Opposite target sputtering: it can increase the deposition rate and make magnetic iron, nickel and other magnetic alloy films
Ion beam (IBS) sputtering: Emission of ions from an ion source
Magnetron sputtering:
The carbon sulfur analyzer is based on DC dipole sputtering, and the magnetic steel is placed behind the target material, using arc light emission
Electricity, used as a source of evaporation.

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