The Different Between The E-Beam Evaporation And Magnetron Sputtering Coating Process

- May 18, 2018-

1. Different coating principle

E-beam evaporation coating: The bombardment of targets with high-energy electron beams causes the surface of the material to be heated to a very high temperature, sublimates directly from the solid state to a gaseous state, and deposits on the surface of the workpiece and formed the thin film. it is mainly used in optics (such as: anti-reflection film of eyeglass, CCD lenses, optical communication, etc.).

Magnetron sputtering coating: The process of high energetic ions bombarding the target and causing the atoms on the surface of the target to separate out is called sputtering. After the use of magnetic field to control, the sputtered atoms or secondary electrons are trapped on the surface of the target in the form of a wheel cycloid, so that the glow is maintained. Sputtering is mainly used for decorative purposes (such as watches, mobile phone cases and other metal surfaces).

2. Different adhesion and binding effect of the film

The adhesion of the electron beam coating is poor, but the uniformity of the film layer is good; the sputtering energy of the sputtering coating is large, and the adhesion to the substrate is also good, but the uniformity of the film layer is somewhat poor.

The electron beam is usually equipped with a crystal oscillator. For an already calibrated material, the control effect of 10 nm or less is good. On the contrary, the film sputtered out has particles, and the thickness of 10 nm is difficult to achieve an accurate and controllable.

3. Different practical materials

Magnetron sputtering has RF power supply, which can be used for insulating material or metal; however, electron beams can only be deposited on metal.