PVD titanium plating new technology risen
PVD(Physical) : PVD(Physical Vapor Deposition) refers to the process of transferring atoms or molecules from the source to the surface of the substrate by using Physical processes. Its function is to enable some particle spraying with special properties (high strength, abrasion resistance, heat dissipation, corrosion resistance, etc.) to be on the matrix with lower performance, so that the matrix has better performance. PVD basic methods: vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, dc discharge ion plating).
PVD is the abbreviation of Physical Vapor Deposition(Physical Vapor Deposition). It refers to the practice of using low-voltage and high-current arc discharge technology to vaporize the target material and ionize both the evaporated material and gas under vacuum conditions. By using the acceleration of electric field, the evaporated material and its reaction products are deposited on the workpiece.
PVD technology appeared in the prepared films with high hardness, low friction coefficient, good wear resistance and chemical stability. The successful application in the field of high-speed steel cutting tools has attracted great attention from the manufacturing industry around the world. While developing high-performance and highly reliable coating equipment, more in-depth application research has also been carried out in cemented carbide and ceramic cutting tools. Compared with the CVD process, PVD process temperature is low, under 600 ℃ when the bending strength of cutting tool materials; The internal stress state of the film is compressive stress, which is more suitable for the coating of cemented carbide precision complicated tools. PVD process has no adverse effect on environment and is in line with the development direction of modern green manufacturing. Currently, PVD coating technology has been widely used in coating treatment of carbide end milling cutter, drill bit, step drill, oil drilling, reamer, tap, indexable milling cutter sheet, turning blade, special-shaped cutter, welding cutter, etc.
PVD technology not only improved the bonding strength of thin film and tool matrix materials, but also developed the coating composition from the first generation of TiN to multi-composite coating such as TiC, TiCN, ZrN, CrN, MoS2, TiAlN, TiAlCN, tin-aln, CNx, DLC and ta-c.
Enhanced magnetic cathode arc: the cathode arc technique is to separate the target into an ion state through low voltage and high current under the vacuum condition, so as to complete the deposition of the thin film material. The enhanced magnetic cathode arc USES the combined action of electromagnetic field to control the arc of target surface effectively, which makes the material's ionization rate higher and the film's performance better.
Filtered cathodic arc: filtered cathodic arc (FCA) electromagnetic filtration system, equipped with high efficient ion source can be produced by the macroscopic particles in plasma and ion mass filter clean, after magnetic filtration of sedimentary particles ionization rate was 100%, and can filter out the larger particles, so the preparation of the film is very compact and smooth, with good corrosion resistance, and the adhesion strength of the body is very strong.
Magnetron sputtering: in a vacuum environment, the target is bombarded by ionized inert gas ions through the combined action of voltage and magnetic field, causing the target to be ejected in the form of ions, atoms or molecules and deposited on the substrate to form a thin film. Conductor and non-conductor materials can be sputtering as target materials according to different ionization power sources used.
Ion beam DLC: carbon hydrogen gas is separated into plasma in the ion source, and carbon ions are released from the ion source under the combined action of electromagnetic field. Ion beam energy is controlled by adjusting the voltage applied to the plasma. The hydrocarbon ion beam is introduced to the substrate and the deposition rate is proportional to the ionic current density. The star arc coating ion beam source adopts high voltage, so the ion energy is larger, which makes the film and substrate bond well. The larger ion current makes the deposition of DLC film faster. The main advantage of ion beam technology is that it can deposit ultra-thin and multi-layer structure, the process control precision can reach several angstrom, and it can reduce the defect caused by the particle pollution in the process to the minimum.
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