PVD is the abbreviation of "Physical Vapor Deposition", which means Physical Vapor Deposition. We now generally vacuum evaporation, sputtering coating, ion plating are called physical vapor deposition. More mature PVD methods are mainly multi-arc plating and magnetron sputtering. The multi-arc plating equipment is simple in structure and easy to operate. Its ion evaporation source on the welding machine power supply can work, its arc ignition process is similar to welding, specifically, in a certain process pressure, the arc ignition needle and evaporative ion source briefly contact, disconnect, gas discharge. Due to the cause of arc coating is mainly by means of moving arc spot, the evaporation source for formation of molten pool on the surface, make the metal evaporated, the film layer is deposited on the substrate, compared with the magnetron sputtering, it not only has the target material utilization rate is high, high ionization rate, more metal ions film the advantages of strong adhesion. In addition, the multi-arc coating color is relatively stable, especially when TiN coating, each batch is easy to get the same stable golden color, the magnetron sputtering method can not match. The disadvantage of multi-arc plating is that, under the condition of making low-temperature coating with traditional DC power supply, when the coating thickness reaches 0.3 m, the deposition rate is close to the reflectivity, and the film formation becomes very difficult, the film surface will gradually become hazy, and the film structure will also become poor, the surface will become rough, so the film layer of multi-arc plating is too thick is not good.
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