Comparison of various dry coating technologies
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coating method | vacuum evaporation | sputtering deposition
| ion plating | Chemical reaction plating(CVD) |
Can be plated material | metal | Certain metallic compounds | Metal, alloy, chemical Complex, ceramics, high molecular compound | Metal, alloy, ceramics, compound |
Film material evaporation method | vacuum evaporation | Vacuum sputtering | Evaporation, sputtering | chemical reaction |
Substrate heating scope ℃ | · 30-200 | · 150-500 | · 150-800 | · 300-1100 |
rate of deposition nm/min | · 2500-75000 | · 10-100 | · 2500-50000 | · much larger than PVD |
The intensity of Interfacial adhesion | · ordinary | · preferably | · good | · good |
The purity of the film | · It depends on the purity of the film material and the film material supporting boat or crucible | · It depends on the purity of target material and sputtering gas | · Depending on the film material, crucible and reaction gas purity | · It depends on the reaction gas |
The properties of the film | · not uniform | · High density, less needle holes, more uniform film | · High density, more uniform, less pinhole | · High purity, good compactness |
Ability to coat complex surfaces | · Straight beam surface of substrate | · Good diffraction, can be plated on all surfaces, the film is uniform | · Can be plated complex heteromorphic surface, deposition surface smooth |