Magnetron sputtering technology is widely used in the field of coating field. It is commonly used for both decorative coating applications and tool coating applications. But there are still many limitations of magnetron sputtering technology. For example, the power density of magnetron sputtering targets is affected by the target thermal load. Under large sputtering current, excessive positive ions bombard the target, which may cause the sputtering target to overheat and burn, besides, the energy of the sputtering is limited, and the metal ionization rate is not high.
In recent years, a high-power pulsed magnetron sputtering (HiPIMS) technology has been developed at home and abroad, which greatly weakens these limitation. The peak power of HiPIMS is about 100 times that of ordinary magnetron sputtering, and the sputtering material has a very high ionization rate, also, this highly ionized beam does not contain large particles, which is why HiPIMS can be easily obtain high quality film layer.
Since the pulse action time is within a few hundred microseconds, the average power of HiPIMS is equivalent to that of ordinary magnetron sputtering, so that the requirement for cooling of the magnetron target is not increased. Although the instantaneous power of high-power pulsed magnetron sputtering is very high, its average power is not too high, so it can be widely promoted.