Technical Parameters
1. Effective Install Space：W7000XL23000XH1500mm | 7.Sputtering:DC magnetron sputtering |
2. Vacuum Chamber：W1650XL16400XH500mm | 8. Rate of Deposition: <2.5µm per time, 0.5nm Precision |
3.Loading Frame: W1050XL1050 | 9.Design:Vacuum chamber and process modularization design |
4.Target Material: Twinned Target W110XL1050mm,or Twinned Target Ф110XL1050mm | 10.Process:Flow gauge and Valve controlled process gas |
5.Work-Piece:ceramic chip, thickness are 2-15mm | 11.Power Source:380V 50Hz |
6. Vacuum Rang: ATM-6X10-4 Pa | 12. External Flange: KF16 and KF25 |
13.Vacuum System: Rotary pump, Roots pump and Molecular pump |
