Integrated in-line metalization system

Integrated in-line metalization system

IKS-H750 Surface Metallization Coating Production Line NdFeB ( neodymium iron boron ) Ceramic Chip Surface Metallization Coating Production Line Equipment Application: NdFeB ( neodymium iron boron ) Ceramic Chip Surface Metallization Coating Production Line, adopt magnetron sputtering process,...
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IKS-H750 Surface Metallization Coating Production Line


NdFeB(neodymium iron boron) Ceramic Chip Surface Metallization Coating Production Line

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Equipment Application:

NdFeB(neodymium iron boron) Ceramic Chip Surface Metallization Coating Production Line, adopt magnetron sputtering process, deposit terbium(Tb) metal film or dysprosium(Dy) metal film on the NdFeB ceramic chip surface, and improve the performance of magnetron ceramic by diffusion treatment.

IKS-H750 production line, is Integrated in-line coating system,realized mass continuous production of small ceramic chip metallization coating, daily production capacity up to 60,000-100,000pcs.Suitable for the NdFeB magnetron ceramic chip surface metallization function films coating, such as sputtering surface modification films, like terbium(Tb),dysprosium(Dy) and aluminum etc. Production line adopts automated design, continuous batch production, high production efficiency, good reliability.

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Technical Characteristics:

1. Mass and batch industrialize production,Batch metalization process.

2. Production line reduce the damage to the environment and human body.

3. It accuracy control the quantity of terbium (Tb) infiltrating and dysprosium (Dy) infiltrating, saved the use of rare material , Improved utilization.

4. Integrated in-line metalization process enhanced the depth of terbium (Tb) infiltrating and dysprosium (Dy) infiltrating, improved performance.

5. Integrated in-line coating system.Standardized and modular designprocess module could improve and adjust, according to the actual production requirement, the upgrade of process and product is easy and low cost.


Technical Parameters:

1. Effective   Install SpaceW7000XL23000XH1500mm

7.Sputtering:DC magnetron sputtering

2. Vacuum ChamberW1650XL16400XH500mm

8. Rate of Deposition: <2.5µm per time, 0.5nm Precision

3.Loading Frame: W1050XL1050

9.Design:Vacuum chamber and process modularization design

4. Target Material: Twinned Target W110XL1050mm,or   Twinned Target Ф110XL1050mm

10.Process:Flow   gauge and Valve controlled process gas

5.Work-Piece:ceramic chip, thickness are 2-15mm

11.Power Source:380V 50Hz

6. Vacuum Rang: ATM-6X10-4 Pa

12. External   Flange: KF16 and KF25

13. Vacuum   System: Rotary pump, Roots pump and Molecular pump

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