Ceramics Metallization Coating Machine

Ceramics Metallization Coating Machine

NdFeB(neodymium iron boron) ceramic chip/column surface metalized coating machine, adopt magnetron sputtering process on the NdFeB(neodymium iron boron)chip/column surface to deposit Tb(terbium) metal film, or Dy(dysprosium) metal film, and improve the performance of magnetic ceramic through diffusion treatment.
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Product Details

IKS-HM Horizontal Mobile Cathode Coating Machine

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l  Equipment Name

 IKS-HM NdFeB(neodymium iron boron) ceramic chip/column surface metalized coating machine

 

 l  Equipment Application

 

NdFeB(neodymium iron boron) ceramic chip/column surface metalized coating machine, adopt magnetron sputtering process on the NdFeB(neodymium iron boron) chip/column surface to deposit Tb(terbium) metal film, or Dy(dysprosium) metal film, and improve the performance of magnetic ceramic through diffusion treatment.

 

l   Production Line Design

 


      IKS-HM Coating machine realized the mass batch production of small ceramic column metallization coating film, it can produce 40,000pcs per day. Suitable for coating the metal functional film on the surface of NdFeB magnetic ceramic column, like the surface modified thin film of sputtering Tb, Dy and Al, etc. It’s fully automatic design, continuous batch production, high production efficiency, high cleanliness, good reliability.

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l  Technical Characteristics

 

1. The surface of ceramic cylinder and ceramic sheet can be coated

2. Production lines reduce the damage to the environment and human body

3. Control the amount of dysprosium and terbium accurately, save the use of rare materials and improve the utilization rate

4. Enhance the depth of osmotic dysprosium and osmotic terbium, improve the performance

5. Standardized and modular design, the process module can be partially improved and adjusted according to the actual production demand. To upgrade the process and product is simple, low cost.

 

l  Technical Parameters

1.Installation   Dimension:W800×L2600×H2200mm

7.Sputtering:DC   magnetron sputtering

2.Chamber   Size:W1250×L1400×H700mm

8.Deposition   Rate:<0.5µm /time,3-6 minute/time

3.Loading   Holder:W950×L750mm

9.Design:Vacuum   chamber and Process modularized

4.Target   Material: planer target W125×L750mm

10.Process:Flow   gauge and Valve control process gas

5.Coated   Work Piece:Ф5-Ф15mm   ceramic column and 2-10mm thickness ceramic chip

11.Power   Source:220V 50Hz

6.Vacuum   Rang:ATM-6×10-4Pa

12.External   Connection Flange:KF16 and KF25

13.Vacuum System: Rotary pump, Roots pump and   Molecular pump

 

l  Equipment Structure Introduction

The equipment consists of the vacuum chamber vacuum pump group loading rackcathode, vacuum measurement and process gas control system.

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1Chamber of come in and out substrate holders

The vacuum chamber, size is W1250×L1400×H700mm.The thickness of chamber board is 20mm, outside cooling, equipped with observation window. Vacuum system: consist of 1pc TRP60 rotary pump, 1pc FF250/2200 molecular pump. Locked with air, used the independent flap valve, simple and effective action. It’s less than 60 seconds to reach 8Pa vacuum degree.

 

2Front inlet substrate holder

    It is W1250×L1200mm,The height of inlet substrate holder is 1200mm,simple to operation, installed full automatic inlet substrate, coating button, and emergency suddenly stop button. Adopted total seal design, designed 2pcs cleaning filter to air feed (FFU), to ensure the cleaning of coating substrate.

3Sputtering Coating Process System

    The sputtering coating process system consisted of one removable cathode and against DC sputtering power source. The size of  cathode target is W125×L950mm, adopted power source is 10KW DC power source which made in China. Process gas supply system use 2pcs of flow gauge and vacuum gauge, to control the vacuum degree. There are two type of work piece holder tray for alternative, one is self rotation tray for ceramic column, one is ceramic chip tray .Both of them could automatic inlet tray and automatic coating process. The deposition thickness of coating controlled and count by the accumulation of coating frequencies and sputtering power, It can be precisely controlled to 0.5nm.

 

 


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